Summer Culinary Launchpad Scholarship 2026

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University of Hawaii Maui College Maui, Stati Uniti 2026

Informazioni

The Summer Culinary Launchpad Scholarship is a targeted tuition award at the University of Hawaii Maui College for students joining a summer-to-fall pathway into the Culinary Arts program. Ten awards of $5,000 each cover tuition for Summer 2026 and Fall 2026, with priority seating in Fall courses for those who complete the summer sequence. The program aims to accelerate progress into the college’s Culinary Arts credentials by tying funding to successful course completion over the summer period.

Benefici

Monetary scholarship of $5,000 per recipient; guaranteed placement in specified Fall courses after completing the summer sequence.

Requisiti

Applicants must enroll in and successfully complete both summer sessions (CULN 120 and CULN 150) and intend to enroll full-time in Fall 2026.

Candidatura

Submit an application for the UHMC Launchpad Scholarship by the stated deadline; expected to enroll full-time in Fall 2026 if selected.

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