IEEE Symposium on Reliability for Electronics and Photonics Packaging (REPP)

The IEEE Symposium on Reliability for Electronics and Photonics Packaging (REPP) focuses on quantified reliability, accelerated testing and probabilistic assessments of the useful lifetime of electronic, photonic, MEMS and MOEMS materials, assemblies, packages and systems in electronics and photonics packaging. It covers failure modes, stress levels, mechanisms, testing schemes, accelerated testing and environmental stresses, bringing together electrical, reliability, materials, mechanical and computer engineers to address design-for-reliability, manufacturing, reliability modeling and related topics.