IEEE 32nd International Symposium for Design and Technology in Electronic Packaging (SIITME)

The IEEE 32nd International Symposium for Design and Technology in Electronic Packaging (SIITME) is an international conference presenting research in electronics, microelectronics, and packaging. It provides an international forum for researchers to present papers and discuss scientific problems, with a mix of oral and poster presentations and opportunities for meetings among participants. The event is supported in part by IEEE and aims to publish proceedings indexed in major databases.