21st International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

The 21st International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) focuses on energy-efficient AI, packaging, PCB design and related topics, covering advanced packaging technologies, power electronics packaging, interconnections, design, AI/ML applications, materials, manufacturing and testing. It aims to present developments in sustainable technologies and smart manufacturing within the field of microsystems, circuits and packaging. The conference emphasizes interdisciplinary topics spanning from packaging to circuits and system applications, with technical sponsorship from IEEE and expected indexing in major databases.