IEEE CPMT Symposium Japan (ICSJ)

The IEEE CPMT Symposium Japan (ICSJ) discusses the future state of electronics packaging, including topics such as Photonics, Advanced Packaging, Signal and Power Integrity, Power Electronics, Automotive Electronics, Interconnections and Bioelectronics, with relevance to AI, data centers, and utilization technology. The event is backed by IEEE and aims to have its proceedings indexed in major databases.