Bond University International Stand Out Scholarship

Bond International Stand Out Scholarship provides 25% tuition remission for international students beginning undergraduate or postgraduate studies at Bond University. The scholarship is awarded on academic merit and is available to international students who meet the eligibility criteria for undergraduate or postgraduate programs in 2026.

25% tuition remission for the entire degree; recognition as an International Stand Out Scholar; access to Bond University’s academic community; flexibility to start in January, May, or September 2026.

International students from eligible countries who have completed high school for undergraduate studies or are applying for postgraduate studies.

Apply for admission to an eligible Bond University program; scholarship eligibility will be automatically assessed with your program application; if awarded, you will receive an offer with a set deadline for acceptance.