27th International Conference on Electronic Packaging Technology (ICEPT) 2026

The International Conference on Electronic Packaging Technology (ICEPT) is a major international conference for electronic packaging and manufacturing technology. It provides a platform for experts, scholars, and researchers to present research via special lectures, invited talks, technical sessions, poster presentations and exhibitions. Accepted manuscripts are submitted for inclusion in IEEE Xplore and selected papers may be recommended for publication in related IEEE/EPS journals.

Opportunity to present research; accepted manuscripts submitted for inclusion in IEEE Xplore; selected papers recommended for related IEEE/EPS journals; participation in invited talks, forums and exhibitions for networking.

Open to global experts, scholars, and researchers in the field of electronic packaging and related technologies.

Submit an original paper with ~500-word abstract describing background, methodology, results and conclusions for peer review; follow conference submission guidelines.